By John G. Webster (Editor)
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Extra resources for 17.Dielectrics and Electrical Insulation
By 1985, this technology began to be replaced above the 200 Vac level with a plastic case, liquid-filled capacitor incorporating a pressure interrupter molded into the cover, and below the 440 Vac level with dry-potted, segmented metallized film construction. An example of the plastic case, liquid-filled capacitor is shown in Fig. 8 (top), and an example of the dry-potted, segmented metallized capacitor is shown in Fig. 8 (bottom). The plastic case, liquid-filled capacitor utilizes an ultrasonic weld for the cover-case seam that is both leak tight and can withstand the high internal gas pressure which develops during a fault interruption of the pressure interrupter.
The thinnest ceramic dielectric previously produced had a 50 WVdc (12 Ȑm thickness) rating which has been reduced to 25, 16, 10, and in rare cases, 6 WVdc (down to 2 Ȑm to 3 Ȑm thickness). Capacitance change (%) Ceramic Capacitors for Small-Signal Applications. The growth of ceramic capacitors has been mainly in small signal applications and only recently in power applications. Their small size, performance, cost and availability have led them to dominate small-signal processing from filtering to decoupling.
The next offering will be the MAT chip with a conductive polymer replacing the manganese dioxide as the cathode plate. MnO2 has been used exclusively in the solid tantalum capacitor because it offers a self-healing effect with these devices. At a fault site in the Ta2O5, the current is localized and high through the MnO2, allowing a conversion of the MnO2 to a higher resistive state such as Mn2O3. This conversion seals or isolates the fault site in the capacitor. In actual manufacturing, there are many fault sites in the dielectric that cause a conversion like this to take place and heal the capacitors but it requires using the semiconductor MnO2 as the cathode plate.
17.Dielectrics and Electrical Insulation by John G. Webster (Editor)